Singh, MadhusudanZaynidinov, HakimjonZaynutdinova, MasturaSingh, DhananjayDepartment of Artificial Intelligence2024-12-162024-12-16201922708-99672708-997510.6180/jase.201909_22(3).0019https://doi.org/10.6180/jase.201909_22(3).0019https://tuit-demo.gcris.com/handle/123456789/52Singh, Dhananjay/0000-0003-3822-9348; Singh, Madhusudan/0000-0001-6913-5200; Zaynidinov, Hakimjon/0000-0002-8098-5246This paper highlights the use of Bi-cubic splines sets for measuring the temperatures at any point (x, y) on printed circuit boards (PCB). This has accomplished by approximating the system of bi-cubic splines of sets of temperatures measured at points on the PCB in a graphical view. The proposed approximation method is using Bi-cubic splines of modeling the temperature field T (x, y) and replace the continuous two variable function by a combination of single variable functions. While developing designs for the navigation and time system (NTS), there is a need for calculating and analyzing the heat generation processes in units in the NTS equipment, which is a factor in choosing design solutions for systems. The boards currently used can conduct full-fledged 3D simulations of heat transfers to PCB which are about 10 percent accurate compared to full-scale tests. It is always difficult to determine the temperatures at specific points on the PCB. Therefore the accurate numbers are only available at the boundaries of temperature zones.eninfo:eu-repo/semantics/closedAccessPrinted Circuit Board (PCB)Bi-cubic SplineThermal FieldNavigation and Time SystemArticleQ2223579586WOS:000490866100019